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d a t a sh eet preliminary speci?cation 2000 may 19 discrete semiconductors UZZ9001 sensor conditioning electronic
2000 may 19 2 philips semiconductors preliminary speci?cation sensor conditioning electronic UZZ9001 features one chip angle sensor output signal conditioning 180 angle range with kmz41 accuracy better than 1 together with kmz41 temperature range from - 40 to +150 c spi protocol so24 package. general description the UZZ9001 is an integrated circuit that combines two sinusoidal signals (sine and cosine) into one single linear output signal. these signals might come from the magnetoresistive sensor kmz41. this results in a measurement system for angles up to 180 . the integrated circuit UZZ9001 can also be used for all other applications in which an angle has to be calculated from a sine and cosine signal. a typical application would be any kind of resolver application. the two input signals are converted into the digital domain with two separate ad converters. a cordic algorithm performs the inverse tangent transformation. the output stage implements the motorola serial peripheral interface (spi) protocol. pinning notes 1. connected to ground. 2. pin to be left unconnected. symbol pin description +v o2 1 sensor 2 positive differential input +v o1 2 sensor 1 positive differential input v dd2 3 digital supply voltage v ss 4 digital ground gnd 5 analog ground rst 6 reset of the digital part; note 1 test1 7 for production test; note 1 test2 8 note 2 data_clk 9 trim-mode data-clock; note 1 smode 10 serial mode programmer; note 1 test3 11 note 2 data 12 spi data output clk 13 spi data clock in cs 14 spi chip select offs2 15 offset trimming input sensor 2 offs1 16 offset trimming input sensor 1 v dda 17 analog supply voltage gnd 18 analog ground test4 19 for production test; note 1 test5 20 for production test; note 1 v dd1 21 digital supply voltage t out 22 test output - v o2 23 sensor 2 negative differential input - v o1 24 sensor 1 negative differential input quick reference data note 1. v dda , v dd1 and v dd2 must be connected to the same supply voltage. symbol parameter conditions min. typ. max. unit v dda supply voltage note 1 4.5 5 5.5 v v dd1 supply voltage note 1 4.5 5 5.5 v v dd2 supply voltage note 1 4.5 5 5.5 v i cctot total supply current no output load - 515ma res resolution - 13 - bit a accuracy with ideal input signal 0.35 -- deg i data-out peak output current -- 10 ma
2000 may 19 3 philips semiconductors preliminary speci?cation sensor conditioning electronic UZZ9001 limiting values in accordance with the absolute maximum rating system (iec 60134). thermal characteristics esd sensitivity symbol parameter conditions min. max. unit v dda supply voltage - 0.3 +6 v v dd1 supply voltage - 0.3 +6 v v dd2 supply voltage - 0.3 +6 v v pin voltage at all pins - 0.3 v dd v t stg storage temperature - 55 +150 c t amb operating temperature 125 to 150 c; max 200 hours - 40 +150 c symbol parameter value unit r th j-a thermal resistance from junction to ambient 80 k/w symbol parameter conditions value unit esd esd sensitivity human body model 2 kv machine model 150 v
2000 may 19 4 philips semiconductors preliminary speci?cation sensor conditioning electronic UZZ9001 electrical characteristics t amb = - 40 to +150 c; v dd = 4.5 to 5.5 v; typical characteristics for t amb =25 c and v dd = 5 v unless otherwise speci?ed. symbol parameter conditions min. typ. max. unit v dda supply voltage 4.5 5 5.5 v v dd1 supply voltage 4.5 5 5.5 v v dd2 supply voltage 4.5 5 5.5 v i dd supply current without load - 515ma (+v o )-( - v o ) differential input voltage referred to v dd 6.6 - 28 mv/v common mode range referred to v dd 490 - 510 mv/v lost magnet threshold referred to v dd -3- mv/v f ext external clock frequency for trim interface 0.1 - 1 mhz f int internal clock frequency 2.3 4 5.7 mhz i o data output constant current -- 1ma peak current -- 10 ma v reset switching voltage between falling and rising v dd 2.8 - 4.5 v threshold hysteresis - 0.3 - v a accuracy with ideal input signal 0.35 -- degree res resolution - 13 - bit t on power up time -- 20 ms t r response time to 95% of ?nal value - 0.7 1.2 ms v id digital input voltage lo signal 0 - 0.3xv dd v hi signal 0.7 x v dd - v dd v v od digital output voltage lo signal -- 0.4 v hi signal v dd - 0.8 -- v v lm sensor voltage lost magnet threshold 12 15 20 mv functional description the UZZ9001 is a mixed signal ic for angle measurement systems. it combines two analog signals (sine and cosine) into a linear output signal. the output stage implements the motorola serial peripheral interface (spi) protocol. the UZZ9001 has been designed for use with the double sensor kmz41. the analog measurement signals on the ic input are converted to digital data with two adcs. the adcs are a sigma-delta modulator employing a 4th order continuous time architecture with an over-sampling ratio of 128 to achieve high resolution. the converter output is a digital bitstream with an over-sampling frequency of typically 500 khz. the bitstream is fed into a decimation filter which performs both low pass filtering and down-sampling. the ic has two input channels each of which has its own adc and decimation filter. the two decimation filter outputs are 15-bit digital words at a lower frequency of typically 3.9 khz which is the typical sampling frequency of the sensor system. the digital representations of the two signals are then used to calculate the current angle. this calculation is carried out using the so-called cordic algorithm. the angle is represented with a 13-bit resolution. an spi compatible interface converts the output word to the serial peripheral interface protocol.
2000 may 19 5 philips semiconductors preliminary speci?cation sensor conditioning electronic UZZ9001 handbook, full pagewidth mhb698 adc1 decimation filter alu spi clk data cs data-clk smode control oscillator + v o1 - v o1 adc2 reset UZZ9001 reset decimation filter + v o2 - v o2 fig.1 block diagram. the following list gives a short description of the relevant block functions: 1. the adc block contains two sigma delta ad converters, sensor offset correction circuitry and the circuitry required for the sensitivity and offset adjustment of the chip output voltage curve. 2. two digital low pass decimation filters convert the low resolution high speed bit stream coming from the adc sigma delta converters into a low speed digital word. 3. the alu block derives an angle value from the two digital inputs using the cordic algorithm. 4. the spi converts the output of the alu block to a spi compatible 16 bit word. 5. the control block provides the clock and the control signals for the chip. 6. the reset block supplies a reset signal during power-up and power-down when the power supply is below a certain value. 7. the oscillator unit generates the master clock. serial peripheral interface (spi) the UZZ9001 provides an interface to spi compatible devices, and as a slave node functions in one operational mode only. for motorola spi devices, this mode is selected by setting cpha to 1 and cpol to 1. in this transfer mode, data bits are sampled by the master using the leading edge of the clock as shown in figure 2. the falling edge indicates that the next data bit has to be provided by the slave device (shift operation). an advantage of this mode is that the cs input toggles only once between every two sensor data bytes (see fig.3). data transmission can be stopped by the user at any time. the leading edge of the cs input initialises the spi shift register allowing the start of a complete new transmission. if the cs line is held active low during stop of transmission, resumption of transmission can be made without loss of data
2000 may 19 6 philips semiconductors preliminary speci?cation sensor conditioning electronic UZZ9001 table 1 spi-timing diagram number parameter symbol min. max. unit remarks/test conditions 1 cycle time t cyc 1 -m s 2 enable lead time t lead 15 - ns determined by master module 3 enable lag time t lag 15 - ns determined by master module 4 clock high time t clk_high 100 - ns determined by master module 5 clock low time t clk_low 100 - ns determined by master module 8 access time t acc 0 20 ns time to data active from ?xed v ss state 9 disable time t dis - 25 ns hold time to ?xed v ss state 10 data valid time (after clock edge) t v - 40 ns with 100 pf on all spi pins 11 data hold time (output, after clock edge) t h 5 - ns operating frequency f op - 1 mhz transmission delay (time between the leading edge of cs until the next falling edge) t delay 1.2 -m s handbook, full pagewidth mhb699 4 5 3 1 9 8 2 11 10 10 msb-out note1 cs clk data lsb-out bits 6-1 fig.2 UZZ9001 spi timing. (1) not defined data, normally lsb of character previously transmitted.
2000 may 19 7 philips semiconductors preliminary speci?cation sensor conditioning electronic UZZ9001 handbook, full pagewidth data cs mhb700 sensor byte 2 sensor byte 1 fig.3 cs line timing. sensor signal coding the sensor signal comprises 14 bits (d13 to d0) as shown in fig.4. bits d12 to d0 are used for the coding of the angle while d0 is reserved to indicate error and diagnostic conditions as defined below. the 14 data bits are arranged in 2 bytes. d13 is the msb of the sensor signal and d0 is the lsb of the sensor signal. byte 2, which is sent first, contains data bits d13 to d7 and additionally the parity bit p2 which is included for the recognition of interrupted messages. p2 gives the odd parity of data bits d13 to d7 and has to be evaluated by the master module.similarly, byte 1 comprises data bits d6 to d0 and parity bit p1, which gives the odd parity of data bits d6 to d0. the internal coding of angle values is as follows: during normal operation, bit d13 is active low. each increment represents an angle value of: the error and diagnostic conditions are indicated by d13 = 1 (active high). in an error situation the last two bits (d0 and d1) specify the error code (see table 2). all other bits (d3 to d12) still show the current measurement value, but as the last two bits are lost for measurement representation the resolution is reduced to 11 bit. table 2 error and diagnostic cases coding 00 0000 0000 0000 b =0 , 180 01 1111 1111 1111 b = d13 do 2 13 1 C () 180 2 13 ------------ 179.978 ? a inc 180 2 13 ------------ = 0.022 ? d1 d0 case measurement value reliable 0 0 no valid value presently available due to reset no 0 1 magnet lost no 1 0 reserved - 1 1 reserved - handbook, full pagewidth mhb701 p2 d13 d12 d11 d10 d9 d8 d7 p1 d6 d5 d4 d3 sensor byte 2 sensor byte 1 d2 d1 d0 msb lsb fig.4 sensor signal coding.
2000 may 19 8 philips semiconductors preliminary speci?cation sensor conditioning electronic UZZ9001 magnet lost condition if both offset corrected input signal of sensor 1 and sensor 2 are below the lost magnet threshold then the failure magnet lost is assumed. offset trimming to achieve a linear output characteristic, it is necessary to shift the offsets of the two input signals to the input stage of the UZZ9001. for this reason a sensor offset cancellation procedure has been implemented in the UZZ9001 which is started by sending a special serial data protocol to the UZZ9001. this trimming procedure is required for both input signals. trim interface the UZZ9001 trim mode serial interface consists of the two terminals smode (pin 10) and data_clk (pin 9). the structure of this protocol is shown in figure 5. all signal levels of data_clk and smode must lie within the ranges set out in table 3. the protocol starts with a falling edge at the smode, which must occur at a high data_clk level. the following five bits are used to code the message sent to the UZZ9001. they are transferred via the smode and are sampled with the rising edge of the data_clk. during the fifth high level output of data_clk (counted from the start condition onwards), a rising edge must appear at the smode and the data_clk follows this with one more change to low level in order to successfully complete the protocol. table 3 de?nition of the trim interface signals parameter min. max. unit low level of data_clk, smode 0 5 %v dd high level of data_clk, smode 95 100 %v dd rise and fall time of data_clk and smode signal edges (10 to 90% v dd ) and (90 to 10% v dd ) 8 - ns data_clk frequency 0.1 1 mhz handbook, full pagewidth mhb702 data_clk (input at pin 9) smode (input at pin 10) tout (output at pin 22) 12345 stop condition statusbit # start condition t1 t0 fig.5 protocol used to set UZZ9001 into trim mode.
2000 may 19 9 philips semiconductors preliminary speci?cation sensor conditioning electronic UZZ9001 table 4 programming of trim modes mode status bits 12345 enter trim mode for sensor input channel 1 0 0 0 1 0 enter trim mode for sensor input channel 2 0 0 1 0 0 leave trim mode for either input channel 0 0 0 0 0 how to enter the trim mode details of voltage levels and timing of the status bits to be transmitted to the UZZ9001 are given in table 3. note that a complete protocol has to be sent before normal operation can be resumed. the trim mode can also be exited by resetting the device. after entering one of the trim modes and provided there is a dynamic input signal there will be a square wave output at the terminal t out (pin 22). reset in addition to the external reset pin (pin 6), the UZZ9001 provides an internal power-up/ power-down reset logic which continuously monitors the supply voltage. when the supply voltage increases and reaches a safe level, reset becomes inactive and the device starts initialization. when the supply voltage exceeds the safe voltage level, the device is reset immediately. this internal reset logic can be over-ridden in all modes and at any time by applying an external active high command to the res input pin (pin 6) in all modes and at any time. the reset pin res (pin 6). this pin is internally pulled to ground and therefore need not be connected if the function is not required. measurement dynamics the UZZ9001 includes an on-chip rc oscillator that generates the clock for the whole device. consequently, no external clock supply is required for the measurement system. the nominal clock frequency of the on-chip oscillator is 4 mhz at room temperature. it varies with temperature change. at - 40 c the clock frequency may decrease to 2.3 mhz. at higher temperatures however, a frequency up to 5.7 mhz may occur. this influences the dynamics of measurements. from an application point of view, two different effects have to be distinguished. the system delay, which means how long it takes until a changed input signal is recognized at the output, and the measurement update rate. the system delay is mainly caused by the settling time of the low pass decimation filter, which depends on the maximum frequency content (shape) of the input signals and the clock frequency. the following maximum values can be expected for the entire system delay. the measurement update rate, however, is directly related to the oscillator frequency. at room temperature, a new value is available every 0.26 ms. when taking the entire temperature range into account, update rates between 0.45 and 0.18 ms are possible. (see table 5)
2000 may 19 10 philips semiconductors preliminary speci?cation sensor conditioning electronic UZZ9001 table 5 system delay and update rates of the UZZ9001 application information parameter min. typ. max. unit system delay (time elapsed until 95% of the ?nal value is reached) max. signal frequency < 200 mhz -- 0.6 ms transients (step response) -- 1.2 ms measurement update rate - 40 c 0.45 -- ms +25 c (room temperature) - 0.26 - ms +150 c -- 0.18 ms handbook, full pagewidth mhb703 c1 100 nf 1 24 2 1 3 2 1 3 + v o2 + v o1 2 23 3 22 2 v dd 6 1 5 offs1 v ss 4 21 5 - v o1 gnd - v o2 3, 4 7, 8 (1) (1) (1) 20 6 19 7 18 8 17 9 16 10 15 11 14 12 13 offs2 spi in/out data out ground clk (clock in) cs (chip select) kmz41 UZZ9001 fig.6 UZZ9001 trim mode configuration. (1) for test applications pin to be left unconnected.
2000 may 19 11 philips semiconductors preliminary speci?cation sensor conditioning electronic UZZ9001 package outline unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p q z y w v q references outline version european projection issue date iec jedec eiaj mm inches 2.65 0.30 0.10 2.45 2.25 0.49 0.36 0.32 0.23 15.6 15.2 7.6 7.4 1.27 10.65 10.00 1.1 1.0 0.9 0.4 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 1.1 0.4 sot137-1 x 12 24 w m q a a 1 a 2 b p d h e l p q detail x e z c l v m a 13 (a ) 3 a y 0.25 075e05 ms-013 pin 1 index 0.10 0.012 0.004 0.096 0.089 0.019 0.014 0.013 0.009 0.61 0.60 0.30 0.29 0.050 1.4 0.055 0.419 0.394 0.043 0.039 0.035 0.016 0.01 0.25 0.01 0.004 0.043 0.016 0.01 e 1 0 5 10 mm scale so24: plastic small outline package; 24 leads; body width 7.5 mm sot137-1 97-05-22 99-12-27
2000 may 19 12 philips semiconductors preliminary speci?cation sensor conditioning electronic UZZ9001 data sheet status note 1. please consult the most recently issued data sheet before initiating or completing a design. data sheet status product status definitions (1) objective speci?cation development this data sheet contains the design target or goal speci?cations for product development. speci?cation may change in any manner without notice. preliminary speci?cation quali?cation this data sheet contains preliminary data, and supplementary data will be published at a later date. philips semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. product speci?cation production this data sheet contains ?nal speci?cations. philips semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. definitions short-form specification ? the data in a short-form specification is extracted from a full data sheet with the same type number and title. for detailed information see the relevant data sheet or data handbook. limiting values definition ? limiting values given are in accordance with the absolute maximum rating system (iec 60134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the specification is not implied. exposure to limiting values for extended periods may affect device reliability. application information ? applications that are described herein for any of these products are for illustrative purposes only. philips semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. disclaimers life support applications ? these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips semiconductors for any damages resulting from such application. right to make changes ? philips semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. philips semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2000 may 19 13 philips semiconductors preliminary speci?cation sensor conditioning electronic UZZ9001 notes
2000 may 19 14 philips semiconductors preliminary speci?cation sensor conditioning electronic UZZ9001 notes
2000 may 19 15 philips semiconductors preliminary speci?cation sensor conditioning electronic UZZ9001 notes
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